Invention Grant
- Patent Title: Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier
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Application No.: US16948969Application Date: 2020-10-08
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Publication No.: US11408076B2Publication Date: 2022-08-09
- Inventor: Heinrich Trischler
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: EP19202577 20191010
- Main IPC: C23C18/16
- IPC: C23C18/16 ; C23C18/31 ; C25D3/38 ; H05K3/22
Abstract:
A method of performing an immersion tin process in the production of a component carrier is provided which includes immersing at least a part of a copper surface of the component carrier in a composition containing Sn(II) in an immersion tin unit, while passing a non-oxidizing gas through the immersion tin unit, wherein at least part of the non-oxidizing gas is recycled. In addition, an apparatus for performing an immersion tin process in the production of a component carrier, a method of performing a copper plating process in the production of a component carrier and an apparatus for performing a copper plating process in the production of a component carrier are provided.
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Information query
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