Invention Grant
- Patent Title: Gallium arsenide crystal substrate
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Application No.: US16630183Application Date: 2018-02-23
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Publication No.: US11408091B2Publication Date: 2022-08-09
- Inventor: Masanori Morishita , Hidetoshi Takayama , Yasuaki Higuchi , Yoshiaki Hagi
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Oliff PLC
- International Application: PCT/JP2018/006654 WO 20180223
- International Announcement: WO2019/163081 WO 20190829
- Main IPC: C30B29/42
- IPC: C30B29/42

Abstract:
A gallium arsenide crystal substrate has a diameter not smaller than 150 mm and not greater than 205 mm and a thickness not smaller than 300 μm and not greater than 800 μm and includes any of a flat portion and a notch portion. In any of a first flat region and a first notch region, when an atomic concentration of silicon is not lower than 3.0×1016 cm−3 and not higher than 3.0×1019 cm−3, the gallium arsenide crystal substrate has an average dislocation density not lower than 0 cm−2 and not higher than 15000 cm−2, and when an atomic concentration of carbon is not lower than 1.0×1015 cm−3 and not higher than 5.0×1017 cm−3, the gallium arsenide crystal substrate has an average dislocation density not lower than 3000 cm−2 and not higher than 20000 cm−2.
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