Invention Grant
- Patent Title: Method for heat-treating silicon single crystal wafer
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Application No.: US16962269Application Date: 2018-12-25
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Publication No.: US11408092B2Publication Date: 2022-08-09
- Inventor: Wei Feng Qu , Ken Sunakawa , Tadashi Nakasugi
- Applicant: SHIN-ETSU HANDOTAI CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee: SHIN-ETSU HANDOTAI CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-026465 20180216
- International Application: PCT/JP2018/047446 WO 20181225
- International Announcement: WO2019/159539 WO 20190822
- Main IPC: C30B1/02
- IPC: C30B1/02 ; C30B33/02 ; C30B29/06

Abstract:
A method for heat-treating a silicon single crystal wafer to control a BMD density thereof to achieve a predetermined BMD density by performing an RTA heat treatment on a silicon single crystal wafer composed of an Nv region in a nitriding atmosphere, and then performing a second heat treatment, the method including: formulating a relational equation for a relation between BMD density and RTA temperature in advance; and determining an RTA temperature for achieving the predetermined BMD density according to the relational equation. Consequently, a method for heat-treating a silicon single crystal wafer for manufacturing an annealed wafer or an epitaxial wafer each having defect-free surface and a predetermined BMD density in a bulk portion thereof.
Public/Granted literature
- US20210062366A1 METHOD FOR HEAT-TREATING SILICON SINGLE CRYSTAL WAFER Public/Granted day:2021-03-04
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