Invention Grant
- Patent Title: High intensity discharge light assembly
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Application No.: US17384074Application Date: 2021-07-23
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Publication No.: US11408602B2Publication Date: 2022-08-09
- Inventor: Mahendra Dassanayake , Gennaro Fedele , Brian Petku , Roshan A. Kandanda , Alfred Laspina
- Applicant: eLUMIGEN, LLC
- Applicant Address: US MI Troy
- Assignee: eLUMIGEN, LLC
- Current Assignee: eLUMIGEN, LLC
- Current Assignee Address: US MI Troy
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: F21V29/51
- IPC: F21V29/51 ; F21V29/77 ; F21V23/06 ; F21V7/05 ; F21V7/28 ; F21V23/00

Abstract:
A light assembly includes a heat pipe having a first condenser portion and a first evaporator portion. The heat pipe has a longitudinally extending wall. A plurality of light sources is disposed at least partially around and thermally coupled to longitudinally extending wall at the first evaporator portion of the heat pipe. A heat sink housing has a heat sink portion, an electronic housing portion and a plurality of fins. The heat sink housing receives the first condenser portion of the heat pipe. The heat sink housing separated from the electronic housing portion by a wall. The electronic defines a drive circuit volume comprising a drive circuit and temperature sensor. The drive circuit reduces current to the light sources in response to the temperature signal.
Public/Granted literature
- US20220010951A1 High Intensity Discharge Light Assembly Public/Granted day:2022-01-13
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