Invention Grant
- Patent Title: Heat exchanger
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Application No.: US17020873Application Date: 2020-09-15
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Publication No.: US11408686B2Publication Date: 2022-08-09
- Inventor: Kazuyuki Akagi
- Applicant: Rinnai Corporation
- Applicant Address: JP Aichi
- Assignee: Rinnai Corporation
- Current Assignee: Rinnai Corporation
- Current Assignee Address: JP Aichi
- Agency: Nakanishi IP Associates, LLC
- Priority: JPJP2019-187630 20191011
- Main IPC: F28F3/06
- IPC: F28F3/06 ; F24H9/1809 ; F28F1/32 ; F28D1/047

Abstract:
A heat exchanger prevents cracking in heat transfer plates while avoiding lowering heat-exchange efficiency. Heat transfer plates are arranged with a space between them, and a hollow pipe extends through the plates. A high-temperature gas flows through the space to exchange heat with a liquid in the hollow pipe. The heat transfer plates are elongated in the direction in which parts of the hollow pipe are aligned and can thus have thermal expansion accumulating in the elongation direction. The heat transfer plates each include a thermal expansion absorber between an edge of the heat transfer plate receiving inflow of the high-temperature gas and an inter-pipe portion between adjacent parts of the hollow pipe to absorb thermal expansion of the heat transfer plate. A selected one or more of the inter-pipe portions, rather than all, include the thermal expansion absorber.
Public/Granted literature
- US20210108865A1 HEAT EXCHANGER Public/Granted day:2021-04-15
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