Invention Grant
- Patent Title: Attachment structure for temperature sensor
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Application No.: US16869876Application Date: 2020-05-08
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Publication No.: US11408775B2Publication Date: 2022-08-09
- Inventor: Tomohiro Matsushima
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2019-091857 20190515
- Main IPC: G01K1/14
- IPC: G01K1/14 ; H01M10/48 ; G01K1/08 ; G01K1/143 ; G01K7/22

Abstract:
An attachment structure for a temperature sensor that is attached to a flexible thin plate-shaped cable and detects the temperature of a unit cell of a battery pack having a plurality of unit cells connected with each other includes: the flexible thin plate-shaped cable; a chip-shaped temperature measuring element that is incorporated on a conductor exposed portion of the flexible thin plate-shaped cable and detects the temperature of the unit cell; and a metal leaf spring that is placed around the conductor exposed portion of the flexible thin plate-shaped cable and has a plurality of legs surrounding the temperature measuring element, and an elastic piece configured to energize the plurality of legs toward the unit cell. The temperature measuring element is sheathed with a moisture-proof material between the plurality of legs of the metal leaf spring.
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