Invention Grant
- Patent Title: Transducer and transducer arrangement for ultrasonic probe systems, ultrasonic probe system and inspection method
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Application No.: US16817862Application Date: 2020-03-13
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Publication No.: US11408861B2Publication Date: 2022-08-09
- Inventor: Thomas Heckel , Rainer Boehm
- Applicant: Bundesrepublik Deutschland, vertreten durch den Bundesminister für Wirtschaft und Energie . . .
- Applicant Address: DE Berlin
- Assignee: Bundesrepublik Deutschland, vertreten durch den Bundesminister für Wirtschaft und Energie . . .
- Current Assignee: Bundesrepublik Deutschland, vertreten durch den Bundesminister für Wirtschaft und Energie . . .
- Current Assignee Address: DE Berlin
- Agency: Bachman & LaPointe, P.C.
- Priority: DE102019106427.9 20190313
- Main IPC: G01N29/07
- IPC: G01N29/07 ; G01N29/22 ; G01N29/24

Abstract:
Described are a transducer made of at least three transducer elements which approximate a sector of an elementary wave with a virtual point source, and a transducer arrangement with three transducers made of at least three transducer elements, wherein the transducers, in the cross section, are disposed along the shorter base and the two non-parallel legs of a virtual trapezoid. Moreover, the invention relates to an ultrasonic probe system comprising the transducer arrangement according to the invention and an inspection method using a transducer made of at least three transducer elements, with the number of transducer elements experiencing a virtual increase.
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