A microelectromechanical system (MEMS) probe for electric connection between a tested contact point of an object to be tested and a testing contact point of a test circuit. The MEMS probe includes: a first terminal contact portion; a second terminal contact portion movable close to and away from the first terminal contact portion; and an elastic connecting portion connecting the first terminal contact portion and the second terminal contact portion, elastically deformed by an approach of the second terminal contact portion and comprising a plurality of plating layers stacked in the elastic deformation direction. According to the present disclosure, the MEMS probe includes a plurality of plating layers stacked in the elastic deformation direction, thereby decreasing fatigue failure and improving durability.