- Patent Title: Device signal separation for full duplex serial communication link
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Application No.: US16721677Application Date: 2019-12-19
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Publication No.: US11408919B2Publication Date: 2022-08-09
- Inventor: P E Ramesh , Tsuyoshi Miyazaki
- Applicant: Tektronix, Inc.
- Applicant Address: US OR Beaverton
- Assignee: Tektronix, Inc.
- Current Assignee: Tektronix, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: Miller Nash LLP
- Agent Andrew J. Harrington
- Priority: IN201821049938 20181231
- Main IPC: H04L5/14
- IPC: H04L5/14 ; G01R19/25 ; H01P3/00

Abstract:
A test and measurement instrument for extracting waveforms from a differential transmission line without disrupting the differential transmission line. The test and measurement instrument includes a first input configured to receive a voltage waveform from a voltage probe electrically coupled to the first and second lines of the differential transmission line that electrically connect a first device and a second device, a second input configured to receive a current waveform from a current probe coupled to the differential transmission line, and one or more processors configured to receive the voltage waveform and the current waveform and determine a voltage of the first device and a voltage of the second device based on the voltage waveform and the current waveform.
Public/Granted literature
- US20200209290A1 DEVICE SIGNAL SEPARATION FOR FULL DUPLEX SERIAL COMMUNICATION LINK Public/Granted day:2020-07-02
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