A through-silicon via (TSV) detecting circuit, a detecting method, and an integrated circuit having the same are disclosed. The TSV detecting circuit includes: an input circuit including a first switching circuit, the first switching circuit comprising a control terminal coupled to a first detection control signal, a first terminal coupled to a first power signal, and a second terminal coupled to a first terminal of a TSV, wherein the first switching circuit is configured to be turned on in response to the first detection control signal to transmit a first power signal to the first terminal of the TSV; and a comparison circuit comprising a first input coupled to a second terminal of the TSV, and a second input coupled to a reference signal, wherein the comparison circuit is configured to compare a signal of the second terminal of the TSV and the reference signal.