- Patent Title: Hardmask composition, hardmask layer and method of forming patterns
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Application No.: US16725191Application Date: 2019-12-23
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Publication No.: US11409198B2Publication Date: 2022-08-09
- Inventor: Seunghyun Kim , Yushin Park , Hyungseok Park , Sunghwan Kim , Hyeonil Jung
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2018-0169795 20181226
- Main IPC: G03F7/11
- IPC: G03F7/11 ; C09D161/12 ; G03F7/30 ; G03F7/20 ; G03F7/16
Abstract:
A hardmask composition, a hardmask layer, and a method of forming patterns, the composition including a solvent; and a polymer including a structural unit represented by Chemical Formula 1, wherein, in Chemical Formula 1, A is a substituted or unsubstituted dihydroxypyrene moiety, and E is a substituted or unsubstituted pyrenyl group.
Public/Granted literature
- US20200209754A1 HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS Public/Granted day:2020-07-02
Information query
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