Invention Grant
- Patent Title: Head-mounted heat dissipation device
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Application No.: US17580565Application Date: 2022-01-20
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Publication No.: US11409344B1Publication Date: 2022-08-09
- Inventor: Yanming Chen , Jiangtao Wu , Weicheng Zhuo , Canjie Lu
- Applicant: Guangzhou Tuowan Digital Technology Co., Ltd. , Guangzhou Three Point One Design Co., Ltd.
- Applicant Address: CN Guangzhou; CN Guangzhou
- Assignee: Guangzhou Tuowan Digital Technology Co., Ltd.,Guangzhou Three Point One Design Co., Ltd.
- Current Assignee: Guangzhou Tuowan Digital Technology Co., Ltd.,Guangzhou Three Point One Design Co., Ltd.
- Current Assignee Address: CN Guangzhou; CN Guangzhou
- Agent Georgi Korobanov
- Priority: CN202123455590.1 20211231
- Main IPC: A42B1/008
- IPC: A42B1/008 ; A42C5/04 ; G06F1/20 ; G06F3/01 ; G02B27/01 ; G06F1/16 ; F04D25/08 ; F04D29/44 ; F04D29/42 ; A42B3/28 ; A61F7/00 ; A41D13/002 ; A41D13/005 ; A61F7/10 ; F24F7/007 ; F04D25/06
Abstract:
A head-mounted heat dissipation device includes a fan assembly and a wearing assembly. The wearing assembly is connected to the fan assembly to fix the fan assembly onto a head of a user. The fan assembly includes a casing and fans arranged in the casing. Air inlets and air outlets are defined in the casing. The air outlets are located on an inner side of the bottom surface of the casing, so that the air from the air outlets can be blown to the user's face. In addition, air guide strips are arranged side by side on a side of the air outlet within the casing for concealing the operation of the fans.
Information query
