Invention Grant
- Patent Title: Method of filling a slit in a metallic smartcard
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Application No.: US17035643Application Date: 2020-09-28
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Publication No.: US11410013B2Publication Date: 2022-08-09
- Inventor: John Ritter , Jonathan David Payne
- Applicant: John Ritter , Jonathan David Payne
- Applicant Address: US IN West Harrison; US OH Harrison
- Assignee: John Ritter,Jonathan David Payne
- Current Assignee: John Ritter,Jonathan David Payne
- Current Assignee Address: US IN West Harrison; US OH Harrison
- Agency: Porter Wright Morris & Arthur LLP
- Main IPC: G06K7/08
- IPC: G06K7/08 ; G06K19/06 ; G06K19/077 ; B32B37/06 ; B32B27/26
Abstract:
A method for filling a through slit in a metal layer for use in a metallic smartcard by providing a metal sheet having at least one through slit extending through the thickness of the metal sheet, applying a polymer resin to the metal sheet so as to substantially fill the slit(s), and curing the resin. A coupling frame for a smartcard, and a smartcard are also provided.
Public/Granted literature
- US20210232887A1 METHOD OF FILLING A SLIT IN A METALLIC SMARTCARD Public/Granted day:2021-07-29
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