- Patent Title: Reconstructing missing slices in slice-based scans of 3D objects
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Application No.: US16531568Application Date: 2019-08-05
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Publication No.: US11410271B2Publication Date: 2022-08-09
- Inventor: Maria H. Oleszkiewicz , Blazej R. Rutkowski , Wojciech Sobala , Piotr Padkowski
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Grant M. McNeilly
- Main IPC: H04N19/587
- IPC: H04N19/587 ; G06T3/40 ; G06T7/70 ; G06T5/50

Abstract:
A method for enhancing a set of object scan images may be provided. The set of object scan images comprises at least two scan images. The method comprises determining first distance and determining an interpolated scan image, by applying an interpolation algorithm comprising determining any pixel of the interpolated scan image as a white pixel if the corresponding pixels on the scan images are both white. The same applies to black pixels. The method may further comprise determining any pixel which corresponding pixels are black on one of the two image scans and white on the other image scans as white (black) if a predefined percentage of the directly surrounding pixels is white (black) in the interpolated scan image. Furthermore, the method comprises inserting the interpolated scan image between the first scan image and the second scan image and repeating the above steps until a stop condition is met.
Public/Granted literature
- US20200074591A1 RECONSTRUCTING MISSING SLICES IN SLICE-BASED SCANS OF 3D OBJECTS Public/Granted day:2020-03-05
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