Invention Grant
- Patent Title: Method of producing electroconductive substrate, electronic device and display device
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Application No.: US16997092Application Date: 2020-08-19
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Publication No.: US11410855B2Publication Date: 2022-08-09
- Inventor: Takashi Daitoku , Susumu Taniguchi , Akiko Seki , Atsushi Sato , Yuhei Horikawa , Makoto Orikasa , Hisayuki Abe
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-146671 20170728
- Main IPC: H01L21/48
- IPC: H01L21/48 ; G03F7/00 ; H01L33/62 ; C23C18/18 ; C23C18/20 ; C23C18/16 ; C23C18/30 ; C23C18/31 ; H01L23/00 ; C23C18/38 ; H01L25/075
Abstract:
A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.
Public/Granted literature
- US20200381266A1 METHOD OF PRODUCING ELECTROCONDUCTIVE SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE Public/Granted day:2020-12-03
Information query
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