Invention Grant
- Patent Title: Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies
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Application No.: US16821536Application Date: 2020-03-17
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Publication No.: US11410961B2Publication Date: 2022-08-09
- Inventor: Andrew M. Bayless , Brandon P. Wirz
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/18 ; H01L25/065
Abstract:
This patent application relates to methods and apparatus for temperature modification within a stack of microelectronic devices for mutual collective bonding of the microelectronic devices, and to related substrates and assemblies.
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