Invention Grant
- Patent Title: Electronic device with embedded component carrier
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Application No.: US15869674Application Date: 2018-01-12
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Publication No.: US11410965B2Publication Date: 2022-08-09
- Inventor: Mikael Tuominen
- Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: CN201710022936.8 20170112
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H05K1/11 ; H01L23/498 ; H01L23/538 ; H05K1/18 ; H05K3/46 ; H05K3/32
Abstract:
An electronic device having a first component carrier and an electronic component which is surface mounted on or embedded within the first component carrier. The electronic device further has a second component carrier. The first component carrier together with the electronic component is at least partially embedded within the second component carrier.
Public/Granted literature
- US20180199438A1 Electronic Device With Embedded Component Carrier Public/Granted day:2018-07-12
Information query
IPC分类:
