Invention Grant
- Patent Title: Semiconductor structure
-
Application No.: US16733761Application Date: 2020-01-03
-
Publication No.: US11411083B2Publication Date: 2022-08-09
- Inventor: Meng-Hsuan Hsiao , Winnie Victoria Wei-Ning Chen , Tung Ying Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/10 ; H01L21/8238 ; H01L29/06 ; H01L29/165 ; H01L27/092 ; H01L29/786 ; H01L29/66

Abstract:
Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a substrate and a first fin and a second fin formed over the substrate. The semiconductor structure further includes a first anti-punch through region formed in the first fin and a second anti-punch through region formed in the second fin and first nanostructures formed over the first fin and second nanostructures formed over the second fin. The semiconductor structure further includes a barrier layer formed over the second anti-punch through region and a first gate formed around the first nanostructures. The semiconductor structure further includes a second gate formed around the second nanostructures. In addition, an interface between the barrier layer and the second anti-punch through region is higher than an interface between the first anti-punch through region and the first gate.
Public/Granted literature
- US20200176567A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2020-06-04
Information query
IPC分类: