Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US17161867Application Date: 2021-01-29
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Publication No.: US11411105B2Publication Date: 2022-08-09
- Inventor: Akimasa Kinoshita
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2020-046992 20200317
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/16

Abstract:
A semiconductor device includes an active region through which a main current passes during an ON state. In the active region, the semiconductor device includes a semiconductor substrate of a first conductivity type, a first semiconductor layer of the first conductivity type, a second semiconductor layer of a second conductivity type, first semiconductor regions of the first conductivity type, gate insulating films, gate electrodes, an interlayer insulating film, first electrodes, a second electrode, first trenches, a second trench, a polycrystalline silicon layer provided in the second trench via one of the gate insulating films, and a silicide layer selectively provided in a surface layer of the polycrystalline silicon layer. The polycrystalline silicon layer and the silicide layer are electrically connected with the gate electrodes.
Public/Granted literature
- US20210296492A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2021-09-23
Information query
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