Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US17213215Application Date: 2021-03-26
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Publication No.: US11411585B2Publication Date: 2022-08-09
- Inventor: Masaki Tada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2020-091568 20200526
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B1/04

Abstract:
A radio-frequency module includes a module substrate having a first principal surface and a second principal surface on opposite sides of the module substrate, a power amplifier capable of amplifying a transmission signal, a low-noise amplifier capable of amplifying a reception signal, a first switch connected to an input terminal of the power amplifier and disposed on the second principal surface, a second switch connected to an output terminal of the low-noise amplifier and disposed on the second principal surface, and a first ground terminal disposed in a region that is on the second principal surface and that is between the first switch and the second switch in plan view of the module substrate.
Public/Granted literature
- US20210376867A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-12-02
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