Invention Grant
- Patent Title: Image sensor mounting board, imaging device, and imaging module
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Application No.: US16758993Application Date: 2018-10-24
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Publication No.: US11412111B2Publication Date: 2022-08-09
- Inventor: Yasunobu Somei
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JPJP2017-206912 20171026
- International Application: PCT/JP2018/039471 WO 20181024
- International Announcement: WO2019/082923 WO 20190502
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146 ; H05K1/18
Abstract:
An image sensor mounting board includes a first substrate and a second substrate. The first substrate has an upper surface with a recess and includes an organic material. The second substrate is located in the recess on the first substrate, has an upper surface on which an image sensor is mountable, and includes an inorganic material.
Public/Granted literature
- US20200344384A1 IMAGE SENSOR MOUNTING BOARD, IMAGING DEVICE, AND IMAGING MODULE Public/Granted day:2020-10-29
Information query
