Invention Grant
- Patent Title: Apparatus for conducting heat
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Application No.: US16888944Application Date: 2020-06-01
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Publication No.: US11412637B2Publication Date: 2022-08-09
- Inventor: Jaani Kärppä , Hanna Rapinoja , Pyry Hartikainen
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: EP19177625 20190531
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01R13/00 ; H01R13/73

Abstract:
An apparatus for conducting heat, including a substrate for receiving one or more electric components and a thermal substance circulation system. The substrate includes a first interface for receiving a first part of the thermal substance circulation system and a second interface for receiving a second part of the thermal substance circulation system such that the substrate is, when in use, in contact with the thermal substance of the circulation system between the first and the second interface. The substrate is heat conductive for transferring heat between the one or more electric components and the thermal substance of the circulation system.
Public/Granted literature
- US20200383242A1 APPARATUS FOR CONDUCTING HEAT Public/Granted day:2020-12-03
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