Invention Grant
- Patent Title: Electronic component mounting machine
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Application No.: US16615456Application Date: 2017-06-14
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Publication No.: US11412647B2Publication Date: 2022-08-09
- Inventor: Jo Ikeyama , Motoshi Mizuno
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/021944 WO 20170614
- International Announcement: WO2018/229892 WO 20181220
- Main IPC: H05K13/04
- IPC: H05K13/04

Abstract:
An electronic component mounting machine including a component supply device to supply a radial lead component to a supply position by feeding a carrier tape holding multiple radial lead components; and a component transfer device to collect the radial lead component supplied to the supply position and mount the radial lead component to a predetermined mounting position. The component supply device includes a locking section engageable with the feed holes of the carrier tape, and a tape feed section for feeding the carrier tape by sliding the locking section in engagement with the feed hole. The component transfer device includes a component holding section to hold the component main body of the radial lead component held by the carrier tape, and a position control section to control the position of the component holding section when holding the component main body.
Public/Granted literature
- US20200178428A1 ELECTRONIC COMPONENT MOUNTING MACHINE Public/Granted day:2020-06-04
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