Invention Grant
- Patent Title: Silver powder mixture, method for producing same, and conductive paste
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Application No.: US16644582Application Date: 2018-09-19
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Publication No.: US11413685B2Publication Date: 2022-08-16
- Inventor: Genta Sasaki , Taku Okano , Yoshio Moteki , Yu Saito
- Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Clark & Brody LP
- Priority: JPJP2017-187249 20170927
- International Application: PCT/JP2018/034543 WO 20180919
- International Announcement: WO2019/065379 WO 20190404
- Main IPC: C07K14/255
- IPC: C07K14/255 ; A61K38/00 ; A61K39/00 ; A61P37/06 ; B22F9/24 ; C09D7/40 ; C09D5/24 ; H01B1/16 ; B22F1/05 ; B22F1/065 ; B22F1/068 ; B22F1/054

Abstract:
A silver powder mixture that is suitable for forming a conductive film on a surface of a member having stretchability, a method for producing the same, and a conductive paste using the silver powder mixture is provided. A silver powder mixture containing filamentous silver powder including spherical and filamentous parts and flaky silver powder having an average particle diameter of 1 μm or more and 50 μm or less and an aspect ratio, which is defined by a ratio of an average long diameter and an average thickness, of 1.5 or more is obtained by adding one kind or two or more kinds of a salt of copper and aluminum and ethylenediaminetetraacetic acid to a silver nitrate aqueous solution, for 60 seconds or more, and then adding a reducing agent containing one kind or two or more kinds of L-ascorbic acid, erythorbic acid, and salts thereof.
Public/Granted literature
- US20210060655A1 SILVER POWDER MIXTURE, METHOD FOR PRODUCING SAME, AND CONDUCTIVE PASTE Public/Granted day:2021-03-04
Information query
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