Invention Grant
- Patent Title: Laser bonding method and laser bonding device
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Application No.: US17433804Application Date: 2020-02-21
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Publication No.: US11413705B2Publication Date: 2022-08-16
- Inventor: Akira Kitashima , Takao Maeda
- Applicant: NICHIRIN CO., LTD.
- Applicant Address: JP Hyogo
- Assignee: NICHIRIN CO., LTD.
- Current Assignee: NICHIRIN CO., LTD.
- Current Assignee Address: JP Hyogo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JPJP2019-031455 20190225
- International Application: PCT/JP2020/007199 WO 20200221
- International Announcement: WO2020/175400 WO 20200903
- Main IPC: B23K26/282
- IPC: B23K26/282 ; F16L47/02 ; B23K26/08 ; B23K37/02 ; B23K26/244 ; B23K103/00 ; B23K101/06

Abstract:
A resin pipe 30 and a resin member 31 are fixed to a setting portion 5 provided on the front side of a base 6, and a timing pulley 13 which is provided on the back side of the base 6 and to which a light emission unit 3 is attached is rotated. As a result, the light emission unit 3 applies laser light 20 to a junction 32 between the resin pipe 30 and the resin member 31 while revolving around the junction 32. This makes it easy to fuse and join the entire outer circumferential surface of the resin pipe 30 with the entire inner circumferential surface of the resin member 31, which are variously shaped and sized.
Information query
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