• Patent Title: (Meth)acryloyl group-containing acrylic-modified alkyd resin and undercoat agent for inorganic-material thin film
  • Application No.: US16480477
    Application Date: 2018-01-18
  • Publication No.: US11414567B2
    Publication Date: 2022-08-16
  • Inventor: Akio UminoHirotake Fukuoka
  • Applicant: DIC Corporation
  • Applicant Address: JP Tokyo
  • Assignee: DIC Corporation
  • Current Assignee: DIC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Locke Lord LLP
  • Priority: JPJP2017-011188 20170125
  • International Application: PCT/JP2018/001340 WO 20180118
  • International Announcement: WO2018/139329 WO 20180802
  • Main IPC: C09D187/00
  • IPC: C09D187/00 C08G81/02 C09D5/00
(Meth)acryloyl group-containing acrylic-modified alkyd resin and undercoat agent for inorganic-material thin film
Abstract:
Provided are a resin material that is superior in coating appearance and adhesion to substrates and can be used not only under organic solvent-diluted conditions but also under aqueous solvent-diluted conditions; an undercoat agent for an inorganic-material thin film containing the same; and a molded body produced by using the undercoat agent for an inorganic-material thin film. Provided are a (meth)acryloyl group-containing acrylic-modified alkyd resin, an active-energy-ray-curable resin composition containing the same, the undercoat agent for an inorganic-material thin film, and a molded body produced by using the undercoat agent for an inorganic-material thin film.
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