Invention Grant
- Patent Title: Processing method
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Application No.: US17086634Application Date: 2020-11-02
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Publication No.: US11414753B2Publication Date: 2022-08-16
- Inventor: Hideomi Hane , Takeshi Oyama , Kentaro Oshimo , Yusuke Suzuki , Jun Ogawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JPJP2019-201376 20191106
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/44 ; C23C16/455 ; C23C16/511 ; B08B9/00
Abstract:
A processing method according to one aspect of the present disclosure includes varying pressure of a processing chamber in a state in which a plasma of a purge gas is formed in the processing chamber, the varying including removing a film deposited in the processing chamber, with the formed plasma.
Public/Granted literature
- US20210130950A1 PROCESSING METHOD Public/Granted day:2021-05-06
Information query
