Invention Grant
- Patent Title: Negative type photosensitive resin composition, photosensitive resist film, pattern forming method, cured film, and method of producing cured film
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Application No.: US16326865Application Date: 2017-08-28
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Publication No.: US11415888B2Publication Date: 2022-08-16
- Inventor: Ryosuke Nakamura , Tomoyuki Ando , Tokunori Yamadaya
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JPJP2016-170206 20160831
- International Application: PCT/JP2017/030721 WO 20170828
- International Announcement: WO2018/043395 WO 20180308
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/11 ; G03F7/38 ; G03F7/004 ; C08K5/55 ; C08K5/49 ; C08K3/22 ; C08L63/00 ; C09D163/00 ; C09D163/04 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/40

Abstract:
A negative type photosensitive resin composition containing an epoxy group-containing resin; a metal oxide; and a cationic polymerization initiator (I). The cationic polymerization initiator (I) contains one or more of a compound represented by Formula (I1) and a compound represented by Formula (I2). In Formula (I1), Rb01 to Rb04 represent an aryl group which may have a substituent or a fluorine atom. In Formula (I2), Rb05 represents a fluorinated alkyl group which may have a substituent or a fluorine atom. A plurality of Rb05's may be the same as or different from one another. q represents an integer of 1 or greater, and Qq+'s each independently represent a q-valent organic cation.
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