Negative type photosensitive resin composition, photosensitive resist film, pattern forming method, cured film, and method of producing cured film
Abstract:
A negative type photosensitive resin composition containing an epoxy group-containing resin; a metal oxide; and a cationic polymerization initiator (I). The cationic polymerization initiator (I) contains one or more of a compound represented by Formula (I1) and a compound represented by Formula (I2). In Formula (I1), Rb01 to Rb04 represent an aryl group which may have a substituent or a fluorine atom. In Formula (I2), Rb05 represents a fluorinated alkyl group which may have a substituent or a fluorine atom. A plurality of Rb05's may be the same as or different from one another. q represents an integer of 1 or greater, and Qq+'s each independently represent a q-valent organic cation.
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