Invention Grant
- Patent Title: Semiconductor structure having vertical fin with oxidized sidewall and method of manufacturing the same
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Application No.: US16934831Application Date: 2020-07-21
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Publication No.: US11417737B2Publication Date: 2022-08-16
- Inventor: Chin-Ling Huang
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L29/417 ; H01L23/525 ; H01L29/423 ; H01L29/66

Abstract:
The present disclosure provides a semiconductor structure having a vertical fin with an oxidized sidewall and a method for preparing the semiconductor structure. The semiconductor structure includes a substrate, a top source/drain, a channel fin, a gate structure, a top cathode/anode, and a vertical fin. The substrate has a bottom source/drain and a bottom cathode/anode. The top source/drain is disposed above the bottom source/drain of the substrate, and the channel fin connects the top source/drain to the bottom source/drain of the substrate. The gate structure is disposed on the channel fin. The top cathode/anode is disposed above the bottom cathode/anode of the substrate, and the vertical fin connects the top cathode/anode to the bottom cathode/anode of the substrate, wherein the vertical fin has an oxidized sidewall.
Public/Granted literature
- US20220028987A1 SEMICONDUCTOR STRUCTURE HAVING VERTICAL FIN WITH OXIDIZED SIDEWALL AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-01-27
Information query
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