- Patent Title: Contacts for semiconductor devices and methods of forming the same
-
Application No.: US17146205Application Date: 2021-01-11
-
Publication No.: US11417739B2Publication Date: 2022-08-16
- Inventor: Meng-Han Lin , Sai-Hooi Yeong , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/40 ; H01L21/8234 ; H01L27/088 ; H01L29/10 ; H01L27/092 ; H01L29/66

Abstract:
Methods for forming contacts to source/drain regions and gate electrodes in low- and high-voltage devices and devices formed by the same are disclosed. In an embodiment a device includes a first channel region in a substrate adjacent a first source/drain region; a first gate over the first channel region; a second channel region in the substrate adjacent a second source/drain region, a top surface of the second channel region being below a top surface of the first channel region; a second gate over the second channel region; an ILD over the first gate and the second gate; a first contact extending through the ILD and coupled to the first source/drain region; and a second contact extending through the ILD, coupled to the second source/drain region, and having a width greater a width of the first contact and a height greater than a height of the first contact.
Public/Granted literature
- US20220115508A1 Contacts for Semiconductor Devices and Methods of Forming the Same Public/Granted day:2022-04-14
Information query
IPC分类: