Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17105657Application Date: 2020-11-27
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Publication No.: US11418225B2Publication Date: 2022-08-16
- Inventor: Kunitoshi Hanaoka , Yoichi Sawada
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2019-218972 20191203,JPJP2020-090886 20200525
- Main IPC: H04B1/00
- IPC: H04B1/00 ; H04B1/04 ; H04B1/10
Abstract:
A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission input terminal; a first transmission amplifier disposed on the first principal surface that amplifies a transmission signal input through the transmission input terminal; and a first switch disposed on the second principal surface that connects and disconnects the transmission input terminal and the first transmission amplifier.
Public/Granted literature
- US20210167803A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-06-03
Information query
