Invention Grant
- Patent Title: Image pickup module and image pickup device
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Application No.: US16097094Application Date: 2017-04-13
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Publication No.: US11418686B2Publication Date: 2022-08-16
- Inventor: Masayuki Okamura , Akihiro Yamaguchi , Chiemi Kubota , Hidenori Shinohara , Kenichi Takeuchi
- Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Applicant Address: JP Hitachinaka
- Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee Address: JP Hitachinaka
- Agency: Volpe Koenig
- Priority: JPJP2016-089030 20160427
- International Application: PCT/JP2017/015165 WO 20170413
- International Announcement: WO2017/188013 WO 20171102
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B7/02 ; G02B27/62 ; G03B30/00 ; H01L27/146 ; G02B7/00 ; G03B17/02

Abstract:
An imaging module includes: a substrate on which an imaging element is mounted and in which a through-hole is formed; a holding section that has a support pin inserted into the through-hole in such a manner that the support pin penetrates the through-hole and that holds an optical system forming a subject image on the imaging element; and an adhesive that is provided in the through-hole and that fixes the substrate to the support pin, and at least a tip end portion of the support pin has a tapered shape from a root side of the support pin toward a tip end of the support pin.
Public/Granted literature
- US20210227108A1 IMAGE PICKUP MODULE AND IMAGE PICKUP DEVICE Public/Granted day:2021-07-22
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