Invention Grant
- Patent Title: MEMS device with enhanced membrane structure and method of forming the same
-
Application No.: US16904560Application Date: 2020-06-18
-
Publication No.: US11418887B2Publication Date: 2022-08-16
- Inventor: Chun-Wen Cheng , Chun Yin Tsai , Chia-Hua Chu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H04R17/02
- IPC: H04R17/02 ; B81B3/00 ; B81C1/00

Abstract:
A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate and a membrane over the substrate. The membrane includes a piezoelectric material configured to generate charges in response to an acoustic wave. The membrane includes a via pattern having first lines that partition the membrane into slices such that the slices are separated from each other at a first region near an edge of the membrane and connected to each other at a second region.
Public/Granted literature
- US20210067880A1 MEMS DEVICE WITH ENHANCED MEMBRANE STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2021-03-04
Information query