Invention Grant
- Patent Title: Back plate and MEMS microphone having the same
-
Application No.: US16803320Application Date: 2020-02-27
-
Publication No.: US11418889B2Publication Date: 2022-08-16
- Inventor: Jong Won Sun , Han Choon Lee , Kum Jae Shin
- Applicant: DB HITEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: DB HITEK CO., LTD.
- Current Assignee: DB HITEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Patterson Thuente Pedersen, P.A.
- Priority: KR10-2019-0024407 20190228
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R1/04 ; H04R7/16 ; H04R7/04
Abstract:
A back plate is disposed in a vibration area of a MEMS microphone. The back plate includes a central area located at a central portion of the back plate and having a plurality of acoustic holes formed therein, and a peripheral area located to surround the central area. The acoustic holes are arranged to be spaced apart from each other by the same interval.
Public/Granted literature
- US20200280808A1 BACK PLATE AND MEMS MICROPHONE HAVING THE SAME Public/Granted day:2020-09-03
Information query
