The present invention provides a thick film element having a coated substrate with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is a heating material, and the mode of heating is electrical heating. The carrier, the thick film coating and the covering layer are selected from a material that fulfills every of the following equations: λ 3 ⁢ A ⁢ ⁢ T 3 - T 0 d 3 = a × λ 1 ⁢ A ⁢ ⁢ T 1 - T 0 d 1 , ⁢ λ 2 ⁢ A ⁢ ⁢ T 2 - T 0 d 2 = b × λ 1 ⁢ A ⁢ ⁢ T 1 - T 0 d 1 , ⁢ λ 2 ⁢ A ⁢ ⁢ T 2 - T 0 d 2 = c × λ 3 ⁢ A ⁢ ⁢ T 3 - T 0 d 3 ; wherein 10≤a≤104, 0