Invention Grant
- Patent Title: Electronic circuit board and electronic circuit device
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Application No.: US16957895Application Date: 2018-12-28
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Publication No.: US11419208B2Publication Date: 2022-08-16
- Inventor: Kumiko Yoshinaga , Eiji Ichikawa , Hirofumi Watanabe , Mototaka Takahashi
- Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Applicant Address: JP Hitachinaka
- Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Current Assignee Address: JP Hitachinaka
- Agency: Foley & Lardner LLP
- Priority: JPJP2017-253047 20171228
- International Application: PCT/JP2018/048412 WO 20181228
- International Announcement: WO2019/131990 WO 20190704
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H02K11/33 ; H05K7/14 ; B62D5/04 ; H05K1/18 ; H05K5/00

Abstract:
A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.
Public/Granted literature
- US20210227687A1 ELECTRONIC CIRCUIT BOARD AND ELECTRONIC CIRCUIT DEVICE Public/Granted day:2021-07-22
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