Invention Grant
- Patent Title: Circuit module and manufacturing method for circuit module
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Application No.: US16537700Application Date: 2019-08-12
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Publication No.: US11419211B2Publication Date: 2022-08-16
- Inventor: Kazushige Sato , Jun Kashirajima , Yuya Eshita , Nobumitsu Amachi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-028308 20170217
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/09 ; H05K1/18 ; H05K3/30 ; H05K3/40 ; H05K3/46

Abstract:
A circuit module (100) includes a substrate (1), on one principal surface of which a first wiring pattern (2) is provided, first electronic components (3-6) constituting a first electronic circuit together with the first wiring pattern (2), a plurality of connection conductors (8), a plurality of external connection terminals, a first resin layer (9), and a second resin layer (12). At least one of the plurality of connection conductors (8) includes a first columnar conductor (8a) extending in a normal line direction of the one principal surface of the substrate (1), and a plate-like conductor (8b) extending in a direction parallel to the one principal surface of the substrate (1). At least one of the plurality of external connection terminals is a second columnar conductor (11) extending in the normal line direction of the one principal surface of the substrate (1).
Information query