Invention Grant
- Patent Title: Instrument panel and method for manufacturing instrument panel
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Application No.: US17262241Application Date: 2019-07-25
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Publication No.: US11420580B2Publication Date: 2022-08-23
- Inventor: Taiki Moriizumi , Atsushi Hanaoka , Mitsuaki Sakaguchi
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JPJP2018-147539 20180806
- International Application: PCT/JP2019/029277 WO 20190725
- International Announcement: WO2020/031727 WO 20200213
- Main IPC: B60R21/205
- IPC: B60R21/205 ; B60R21/2342 ; B62D65/14
Abstract:
Provided are: an instrument panel capable of stably deploying a deployment part; and a method for manufacturing the instrument panel. An instrument panel is provided with: a base part; and a deployment part which is surrounded by the base part, faces an air bag, and includes a tear line, wherein a slit structure including a plurality of slits arranged so as to surround the tear line is formed in the deployment part.
Public/Granted literature
- US20210155193A1 INSTRUMENT PANEL AND METHOD FOR MANUFACTURING INSTRUMENT PANEL Public/Granted day:2021-05-27
Information query
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