Invention Grant
- Patent Title: Device and method for transferring components
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Application No.: US16774694Application Date: 2020-01-28
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Publication No.: US11420829B2Publication Date: 2022-08-23
- Inventor: Jian Cao , Lvhai Hu , Fengchun Xie , Yun Liu , An Yang , Yingcong Deng , Roberto Francisco-Yi Lu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Services GmbH
- Applicant Address: CN Shanghai; CH Schaffhausen
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Services GmbH
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Services GmbH
- Current Assignee Address: CN Shanghai; CH Schaffhausen
- Agency: Barley Snyder
- Priority: CN201910099103.0 20190131
- Main IPC: B65G47/90
- IPC: B65G47/90 ; H01R43/20 ; B25J19/02 ; B25J9/16

Abstract:
A device for transferring components includes a transfer assembly and a drive assembly. The transfer assembly has a transfer track transferring a plurality of components therein. The transfer track has an operation position for operating the components. The drive assembly has a first drive mechanism transferring a first set of components of the components at the operation position in the transfer track and a second drive mechanism transferring a second set of components of the components at the operation position in the transfer track. The first drive mechanism and the second drive mechanism in turn drive the first set of components and the second set of components, continuously transferring the components.
Public/Granted literature
- US20200247620A1 Device And Method For Transferring Components Public/Granted day:2020-08-06
Information query
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