Invention Grant
- Patent Title: Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product
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Application No.: US17271216Application Date: 2019-08-20
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Publication No.: US11421071B2Publication Date: 2022-08-23
- Inventor: Hiroshi Sato , Yuko Shibata , Tomoyuki Suzuki
- Applicant: NIPPON STEEL Chemical & Material Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: NIPPON STEEL Chemical & Material Co., Ltd.
- Current Assignee: NIPPON STEEL Chemical & Material Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JPJP2018-158145 20180827
- International Application: PCT/JP2019/032334 WO 20190820
- International Announcement: WO2020/045150 WO 20200305
- Main IPC: C08G59/14
- IPC: C08G59/14 ; C08J5/24

Abstract:
An object is to provide an epoxy resin composition which exhibits excellent tracking resistance and additionally has excellent heat resistance with a Tg of 200° C. or higher and flame retardancy. Provided is an epoxy resin composition which contains a phosphorus-containing epoxy resin and a curing agent and has a phosphorus content of within a range of 1.0 to 1.8%, wherein the phosphorus-containing epoxy resin has a ratio (L/H) of 0.6 to 4.0 of the content of trinuclear bodies (L) to the content of hepta or higher nuclear bodies (H) measured by GPC, and is a product obtained from a novolac epoxy resin having an average number of functional groups (Mn/E) of 3.8 to 4.8 and a phosphorus compound represented by the following general formula (1) and/or general formula (2).
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