Invention Grant
- Patent Title: Polyimide-polybenzoxazole precursor solution, polyimide-polybenzoxazole film, and preparation method therefor
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Application No.: US17187055Application Date: 2021-02-26
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Publication No.: US11421081B2Publication Date: 2022-08-23
- Inventor: Doo Li Choi , Hak Gee Jung
- Applicant: KOLON INDUSTRIES, INC.
- Applicant Address: KR Seoul
- Assignee: KOLON INDUSTRIES, INC.
- Current Assignee: KOLON INDUSTRIES, INC.
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0093710 20150630
- Main IPC: C08G73/22
- IPC: C08G73/22 ; C08J5/18 ; C08G73/10 ; C08G61/12 ; C08L79/08

Abstract:
A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.
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