Invention Grant
- Patent Title: Composition for electroless plating underlying membrane
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Application No.: US16628415Application Date: 2018-07-09
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Publication No.: US11421115B2Publication Date: 2022-08-23
- Inventor: Satoshi Hachiya , Fumioki Fukatsu
- Applicant: IDEMITSU KOSAN CO., LTD.
- Applicant Address: JP Chiyoda-ku
- Assignee: IDEMITSU KOSAN CO., LTD.
- Current Assignee: IDEMITSU KOSAN CO., LTD.
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2017-135727 20170711
- International Application: PCT/JP2018/025933 WO 20180709
- International Announcement: WO2019/013179 WO 20190117
- Main IPC: C09D5/24
- IPC: C09D5/24 ; C09D175/06 ; C09D179/02 ; C23C18/16 ; C23C18/38 ; C09D163/00 ; C08L79/02 ; C09D175/04 ; C08L75/06 ; C08L75/04 ; C09D175/08 ; C08L75/08
Abstract:
A composition for forming an electroless plating undercoat comprising: (A) a conductive polymer (B) one or more resins selected from the group consisting of a polyester polyol resin and a polyether polyol resin; and (C) a polyisocyanate compound.
Public/Granted literature
- US20200165468A1 COMPOSITION FOR ELECTROLESS PLATING UNDERLYING MEMBRANE Public/Granted day:2020-05-28
Information query
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