Invention Grant
- Patent Title: Electroconductive paste
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Application No.: US17282537Application Date: 2019-09-25
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Publication No.: US11421116B2Publication Date: 2022-08-23
- Inventor: Katsutomo Wakabayashi , Yuka Azakami , Yuji Abe , Akinori Naruse , Kazutoshi Koshimizu
- Applicant: Fujikura Kasei Co., Ltd. , Fujikura Ltd.
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Fujikura Kasei Co., Ltd.,Fujikura Ltd.
- Current Assignee: Fujikura Kasei Co., Ltd.,Fujikura Ltd.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Wood Herron & Evans LLP
- Priority: JPJP2018-197579 20181019
- International Application: PCT/JP2019/037492 WO 20190925
- International Announcement: WO2020/080049 WO 20200423
- Main IPC: H01B1/22
- IPC: H01B1/22 ; C09D5/24 ; C09D7/40 ; C09D7/20 ; C09D175/06 ; H05K1/09 ; H05K3/12
Abstract:
An electroconductive paste according to the present invention contains a binder (A), a silver powder (B), crosslinked resin particles (C) having a glass transition temperature of 35° C. or lower, and an organic solvent (D).
Public/Granted literature
- US20210348002A1 ELECTROCONDUCTIVE PASTE Public/Granted day:2021-11-11
Information query
