Invention Grant
- Patent Title: Polishing composition
-
Application No.: US17199036Application Date: 2021-03-11
-
Publication No.: US11421132B2Publication Date: 2022-08-23
- Inventor: Takahiro Umeda
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Aichi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Aichi
- Agency: Katten Munchin Rosenman LLP
- Priority: JPJP2020-061354 20200330,JPJP2021-024996 20210219
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321
Abstract:
To provide a novel polishing composition capable of improving the polishing speed of metal (particularly, tungsten) and maintaining stability as a composition.
A polishing composition contains abrasive grains; quaternary amine having at least one alkyl group having 2 or more carbon atoms or a salt thereof; and a liquid carrier, wherein a pH of the polishing composition is from 2 to 5, and a zeta potential of the abrasive grains in the polishing composition is adjusted to 15 mV or more and less than 40 mV over the entire range of pH 2 to pH 4.
A polishing composition contains abrasive grains; quaternary amine having at least one alkyl group having 2 or more carbon atoms or a salt thereof; and a liquid carrier, wherein a pH of the polishing composition is from 2 to 5, and a zeta potential of the abrasive grains in the polishing composition is adjusted to 15 mV or more and less than 40 mV over the entire range of pH 2 to pH 4.
Public/Granted literature
- US20210301175A1 POLISHING COMPOSITION Public/Granted day:2021-09-30
Information query
