An optical communication module made with transparent packaging material which locates elements and provides protection against contaminants and EMI includes a printed circuit board; a photoelectric element disposed on the printed circuit board; an optical-fiber connector disposed on the printed circuit board, corresponding to the photoelectric element; the transparent packaging material covers the printed circuit board, the photoelectric component and the optical-fiber connector. An electromagnetic shielding layer covers the transparent packaging material. A method of manufacturing same is also disclosed.