A forming apparatus includes a substrate holder having a plurality of chucking regions that chuck a lower surface of the substrate and configured to hold the substrate by chucking the substrate with the plurality of chucking regions, and a controller configured to control execution of a forming process and independently control a chucking force of each of the plurality of chucking regions. The controller controls a chucking force of each of the plurality of chucking regions in a mold separation step so as to make a final mold separation point, at which the mold finally separates from the composition, coincide with a center of a pattern surface of the mold.