Invention Grant
- Patent Title: Substrate processing system, method of manufacturing semiconductor device, and recording medium
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Application No.: US16918626Application Date: 2020-07-01
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Publication No.: US11422528B2Publication Date: 2022-08-23
- Inventor: Yasuhiro Mizuguchi , Shun Matsui , Tadashi Takasaki , Naofumi Ohashi
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JPJP2019-125202 20190704
- Main IPC: G05B19/406
- IPC: G05B19/406 ; H01L21/67

Abstract:
There is provided a technique that includes a plurality of substrate processing apparatuses each configured to process a substrate; a first controller installed in each substrate processing apparatus among the plurality of substrate processing apparatuses and configured to control the substrate processing apparatus; a relay configured to receive a plurality of types of data from the first controller; and a second controller configured to receive the data from the relay, wherein the relay is configured to change a transmission interval of the data to the second controller according to one of each type of the data and each first controller, or according to both of each type of the data and each first controller.
Public/Granted literature
- US20210003990A1 SUBSTRATE PROCESSING SYSTEM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM Public/Granted day:2021-01-07
Information query
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