Invention Grant
- Patent Title: Image sensor with conductive pixel separation structure and method of manufacturing the same
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Application No.: US16924723Application Date: 2020-07-09
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Publication No.: US11424285B2Publication Date: 2022-08-23
- Inventor: Young-sun Oh , Dong-hyuk Park , Hee-sang Kwon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2015-0175352 20151209
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor includes a first pixel separation structure in a substrate to separate pixels from each other. The first pixel separation structure includes a conductive layer therein. Moreover, the image sensor includes a wire layer that is spaced apart from the conductive layer on the substrate. A second pixel separation structure is adjacent to the first pixel separation structure in a first horizontal direction and is connected to a contact. The first and second pixel separation structures extend longitudinally in a second horizontal direction that is perpendicular to the first horizontal direction.
Public/Granted literature
- US20200343294A1 IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-10-29
Information query
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