Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17123109Application Date: 2020-12-16
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Publication No.: US11424768B2Publication Date: 2022-08-23
- Inventor: Hiromichi Kitajima
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2019-237093 20191226
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H04L5/16 ; H04B1/00 ; H03F3/189 ; H04B1/16

Abstract:
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier disposed on the module board; a low noise amplifier disposed on the module board; a transmission filter (a first acoustic wave filter) disposed on one of the first principal surface and the second principal surface; and a reception filter (a second acoustic wave filter) disposed on one of the first principal surface and the second principal surface. An absolute value of a temperature coefficient of frequency (TCF) of the transmission filter is smaller than an absolute value of a TCF of the reception filter, and a distance between the transmission filter and the power amplifier is shorter than a distance between the reception filter and the power amplifier.
Public/Granted literature
- US20210203365A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-07-01
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