Invention Grant
- Patent Title: Distributed lifecycle management for cloud platforms
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Application No.: US16783018Application Date: 2020-02-05
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Publication No.: US11424981B2Publication Date: 2022-08-23
- Inventor: Tyler Easterling , Kyle Meyer Byerly , Michael A. Scheetz
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H04L41/0806
- IPC: H04L41/0806 ; G06F9/50 ; G06F9/455 ; H04L67/00 ; H04L67/10

Abstract:
An example system includes a number of nodes each including a processor and a non-transitory machine readable medium storing a copy of an operating system image. Each copy of the operating system image may include a minimum set of artifacts of a cloud platform application and lifecycle manager program instructions that when executed by any of the nodes instantiate a lifecycle manager for the respective node. The lifecycle manager may be configured to in response to receiving a platform cluster creation request automatically establish a cloud platform of the cloud platform application including the respective node as a sole member and then invite others of the nodes to join the cloud platform. The lifecycle manager may also be configured to in response to receiving an invitation to join an established cloud platform of the cloud platform application and automatically integrate the respective node into the established cloud platform.
Public/Granted literature
- US20200177451A1 DISTRIBUTED LIFECYCLE MANAGEMENT FOR CLOUD PLATFORMS Public/Granted day:2020-06-04
Information query